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Sold by Bourne Electronics
NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability of NC257-2 results in bright, smooth and shiny solder joints, and it has been specifically formulated to lower solder beading. It also offers very low post process residues, which remain crystal clear and easily probed. This solder paste offers a chemistry developed for use in air reflow, as well as providing slump and humidity tolerances to extend the useable life in facilities where environmental control is not at its optimum.
15g Syringe
Features
• RoHS Compliant
• Broad Printing Process Window
• Clear Pin–Probe Testable Residue
• Reduces Voiding Under Micro-BGAs
• Vapor Phase Compatible
• Low-Tombstoning
• 24 Hour Stencil Life
• Low Solder Beading
• Excellent Wetting
• No Head-in-Pillow
• 12-14 Hour Tack Time
• General Metal Load 88.5%
Warranty
Shop with confidence, this item comes with 1 Year WARRANTY
This product is sold by a third-party seller and they are responsible for their product, the content of their listing and any exchanges or returns of their product.
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