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High-quality 80g soldering flux paste designed for precision soldering and electronic repairs.
Perfect for mobile phone, PC card, and chip-level work, it ensures smooth soldering, strong adhesion, and excellent conductivity without corrosion or residue.
Main Features:
Provides excellent solderability and smooth flow
Non-corrosive and safe for delicate components
Strong insulation with neutral pH balance
Improves solder adhesion and reduces oxidation
Ideal for mobile phones, PCBs, and microchip repairs
Specifications:
Net Weight: 80g
Viscosity: 1 (Pa*S0)
Granularity: 1 (um)
pH Value: Neutral (7.03)
Type: Rosin-based flux paste
Applications: Mobile phone, PC card, and electronic chip repair
This product is sold by a third-party seller and they are responsible for their product, the content of their listing and any exchanges or returns of their product.
All products sold by third-parties are subject to the Kogan Guarantee. For more details click here.
